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1. Flexible Thermal Ground Planes Fabricated With Printed Circuit Board
Technology
Author and Article Information
J. Electron. Packag 139(1), 011003 (Dec 07, 2016) (10 pages)
History: Received August 30, 2016; Revised November 13, 2016
2. Thin Flexible Thermal Ground Planes: Fabrication and Scaling
Characterization
Published in: Journal of Microelectromechanical Systems
( Volume: 24, Issue: 6, Dec. 2015 )
Page(s): 2040 - 2048
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