安安各位
看到板上亂糟糟
讓我們來看看 Intel CEO Gelsinger 到底說了啥
Gelsinger shared his vision for “IDM 2.0,” a major evolution of Intel’s
integrated device manufacturing (IDM) model.
Intel CEO 提出了所謂的 IDM 2.0 計畫, 並且把他列為 Intel 接下來發展的 "Vision", 國外的企業非常重視所謂的願景, 所以基本上他就是未來 Intel 在 integrated device manufacturer 上面的重大發展方向.
所以整場重點就是這個 IDM 2.0
IDM 2.0 represents the combination of three components that will enable the
company to drive sustained technology and product leadership:
IDM 2.0 主要有 3 個要點, 可以讓 Intel 保持技術/產品領導地位. 基本上就是再次闡述這個 IDM 2.0 的重要性
1. Intel’s global, internal factory network for at-scale manufacturing is a key
competitive advantage that enables product optimization, improved economics
and supply resilience. Today, Gelsinger re-affirmed the company’s
expectation to continue manufacturing the majority of its products
internally. The company’s 7nm development is progressing well, driven by
increased use of extreme ultraviolet lithography (EUV) in a rearchitected,
simplified process flow. Intel expects to tape in the compute tile for its
first 7nm client CPU (code-named “Meteor Lake”) in the second quarter of
this year. In addition to process innovation, Intel’s leadership in
packaging technology is an important differentiator that enables the
combination of multiple IPs or “tiles” to deliver uniquely tailored
products that meet diverse customer requirements in a world of pervasive
computing.
Intel CEO 重申 (re-affirmed) 希望 Intel 可以繼續在內部製造他們絕大多數的產品.
並且表明 Intel 7nm 目前的開發計畫順利, 已經導入跟台積電/三星一樣的 EUV 技術, 預計今年第 2 季會將 7nm 技術用於下一代的 Meteor Lake 中.
註: Meteor Lake 是 Intel 2023 要問世的 CPU 代號