http://www.digitimes.com/news/a20170908PD210.html
AMD will continue to contract Globalfoundries to manufacture its
next-generation Vega GPUs, and will have Siliconware Precision Industries
(SPIL) as its major packager for the chips, according to industry sources.
The supply of AMD's Vega 10 GPUs has fallen short of demand, thanks to robust
demand for artificial intelligence (AI), Bitcoin mining and gaming
applications since 2017, the sources said.
Globalfoundries uses its 14nm FinFET process technology to fabricate AMD's
Vega 10-series GPUs, and is expected to land orders for the next-generation
Vega 11 series, the sources indicated.
Packaging specialist SPIL, which has already obtained orders for AMD's Vega
10-series chips, will continue to hold the majority of backend orders for the
Vega 11 series, the sources noted.
The popularity of AMD's and Nvidia's high-end GPUs for applications such as
AI has drawn much attention to the importance of packaging technologies for
2.5D/3D solutions, the sources identified. Heterogeneous integration for use
in high-bandwidth memory (HBM) devices also requires such advanced packaging
techniques.
Taiwan Semiconductor Manufacturing Company (TSMC) with its CoWoS
(chip-on-wafer-on-substrate) technology has reportedly secured orders for AI
chips from Nvidia and Google. TSMC has further enhanced its advanced
packaging capability eyeing a bigger presence in the supercomputer field, the
sources said.
AMD's rumored Vega 20 series will be applied to supercomputers, according to
the sources. AMD is likely to switch orders to TSMC, which will use its 7nm
FinFET process and CoWoS packaging to fabricate the Vega 20-series GPUs, the
sources noted.