認真回,NAND有試做過16stack(LVM)和32stack(技術宣誓,上膠體實在太厚了)。LPDDR4 目前 HVM 2 dice side by side, TTL 4 dice =4GB/PKG要做上去 4or 6 dice SBS,TTL 8 or 12 dice大概也會遇到膠體太厚塞不進CPU上面的小縫縫,或dice磨太薄,量產被歪棒直接插破dice的問題吧
https://i.imgur.com/zlrTmE5.jpghttps://i.imgur.com/6K1gHjh.jpgDRAM dice 疊疊樂快疊到天花板了,之後大概只能繼續期TSV 3DIC了
https://i.imgur.com/ll6PvGE.jpg